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BGA Rework System
, QUICK BGA2015
Features
1. IR2015 Infrared reflow soldering section of BGA rework system
Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution.
2. PL2015 Precise aligning and placing system of BGA rework system
Visible double-colors optical lens alignment, overlap alignment between solder ball and soldering pad is scientific and accurate; easy control, and pick-up and placement.
3. RPC2015 Reflow Camera of BGA rework system
The melting process of BGA solder ball can be observed from different angles, provides critical information to get accurate and reliable process curve.
4. IRsoft Software of BGA rework system
The whole process can be recorded, controlled and analyzed and then generate curve diagram by connecting to PC, can meet the demands of modern electronic industry.
Specifications
IR Infrared Rework System
| Model | IR2015 |
| General power | 2800Watt(max) |
| Power of bottom heater | 500W*4=2000Watt or |
| 400W*4=1600Watt(High Infrared heating tube/ Dark Infrared heater optional) | |
| Power of top heater | 180W*4=720Watt (Infrared heating tube, wavelength about 2-8μm) |
| Size of top heater | 60*60mm |
| Size of bottom heater | 267*280mm |
| Range of top heater | 20-60mm(X, Y direction both adjustable) |
| Vacuum pump | 12V/300mA, 0.05Mpa(max) |
| Top cooling fan | 12V/300mA, 15CFM |
| Laser alignment tube | 3V/30mA |
| Movable motor | 24V DC/100mA |
| Movable arm range | 93mm |
| Max PCB size | 420mm*500mm |
| LCD window | 65.7*23.5mm 16*2 characters |
| Communication | RS-232C(connect with PC) |
| Infrared temperature sensor | 0-300℃(Testing Range) |
| External K-type sensor | Optional |
PL Precision Placement System
| Model | PL2015 |
| Power | About 15Watt |
| Camera | 22*10 times magnifying; 12V/300Ma Horizontal resolution: 480 lines; PAL format |
| Lens size | 60mm*60mm |
| Size of BGA to be aligned | 60mm*60mm |
| Vacuum pump | 12V/600mA 0.05Mpa(max) |
| Camera output signal | Video Signal |
| Weight | 22kg |
RPC Reflow Soldering Process Camera of BGA rework system
| Model | RPC2015 |
| Power | About 15Watt |
| Camera | 22*10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format |
Main Parts of BGA Rework System
Infrared heating system of BGA rework system
Open-type dark infrared heating, non-contact infrared temperature sensor monitors the surface temperature changes of BGA, realize closed-loop control, ensure precise temperature technical window and even heat distribution.
Top heater of BGA rework system
The top heater uses 2-8μm long wave infrared heating tube, 720W, heating area can be adjusted according to sizes of BGA, protect adjacent components from being heated. No need of nozzles, save cost.
Bottom heater of BGA rework system
The bottom heater uses 4 sets of dark infrared heating plates, with a large power 1600W. Larger PCBs can be placed and heated evenly, avoid deformation and damage.
Optical lens alignment of BGA rework system
The PL part uses optical lens to align components. Red top light, white bottom light, brightness is adjustable. Light source reflected by lens to ensure BGA solder ball and PCB solder pad in line with each other and even.
The solder ball and pad will show clearly in the monitor through the camera of PL part. By adjusting the X, Y axis fine knob and component control knob, solder ball which displays in red and solder pad which displays in white can overlap completely.
Alignment adjustment of BGA rework system
The most precise alignment can realize by fine adjustment of X, Y, Z angles.
Components aligning knob can make BGA 360° rotating.
PCB fixing of BGA rework system
The flexible PCB supporting rod can fix PCB effectively, absorb the expansion force resulted from heating or cooling, prevent the PCB from distortion.
Special PCB can be fixed by different clamps. The supporting rod can be used for the bottom of large PCB to avoid distortion.
