1. Use excellent heating materials, control the process of BGA soldering and desoldering accurately. 2. Use large power brushless DC fan; Temperature controlled by closed loop sensor and zero triggering; Large generation of hot air. 3. Various of titanium nozzles available; Easy to replace. 4. Program can be set to control top and bottom hot air temperature, precise and even. 5. Powerful fan cools bottom heating area rapidly. 6. By means of QUICKSOFT, it's easy to operate the system.
Specifications:
General Power 3500Watt(max) Power Supply 220V/230V AC, 50/60Hz Power of Top Heater 800Watt Power of Bottom Pre-heater 400Watt*4=1600Watt(Infrared heater) Power of Bottom Heater 800Watt Speed of Side Cooling Fan 3.5/min Temperature Range(Hot air) 500(Max) Temperature Range(Preheating) 500(Max) Bottom Preheating Area 330*360mm Max PCB Size 330*360mm Outside K-type Sensor 3 pcs Communication RS-232C(connect with PC) Net Weight About 23.5kg Outer Dimensions 610(L)*580(W)*520(H)mm
Main Parts:
Heating System Use large-power brushless DC fan; temperature controlled by closed loop sensor and zero triggering; large generation of hot air. Program can be set to control top and bottom hot air temperature, accurate.
Heating power of top and bottom heater: 800 Watt both. Hot air volume which can be stepless adjusted can result in rapid temperature rising of main heating area, even distribution and minimizes temperature differences between chip surface and soldering joint to shorten operating time. Bottom large-area infrared preheating mechanism is used. The power consumption can be up to 1600 Watt to meet all the demands of PCB preheating.
Cooling System Triple side cooling at the same time make BGA and PCB cooled down gradually. The air volume of side cooling fan can be adjusted as per requirement.
.gif){kind=small}
3.5
/min
(Max)
Heating System
