Main Advantages: 1.      Integrative structure design. The perfect integration of optical aligning, placing mechanism and          heating system makes aligning and placing of components on PCB easy and convenient. 2.      High automatization. The movement of top heater is controlled by PC(up-and-down moving          and lifting after de-soldering of components). 3.      Excellent design of PCB clamping; Easy to place and remove PCB. 4.      The integration of large-area preheating and sectional hot air heating minimizes temperature          differences between BGA packaging surface and soldering joint. It not only prevents PCB          from being distorted, but also shortens BGA soldering time to reduce risk of damaging PCB          and BGA components. Features: 1.      Use large power brushless DC fan; Temperature controlled by closed loop sensor and zero          triggering; Large generation of hot air. 2.      Control heating of bottom infrared pre-heater separately. 3.      Various of titanium nozzles available; Easy to replace. 4.      PCB bracket adjustable; Motor controls adjustment. 5.      Program can be set to control top and bottom hot air temperature, precise and even. 6.      Powerful fan cools bottom heating area rapidly. 7.      By means of QUICKSOFT, it's easy to operate the system. Operating can be controlled          by password to prevent process from being changed.

Specifications: Power Supply                                         220V AC, 50Hz, 5K Watt Max PCB Size                                        600*500mm Min IC Size                                             2*2mm Max IC Size                                            60*60mm Size of Bottom Heater                             550*450mm LCD Display Window                             100*75mm  16*2 characters Mounting Accuracy                                 0.025mm Hot air Temperature                                 500(Max) Bottom Preheating Temperature               500(Max) Power of Top Heater                               800Watt Power of Bottom Heater                          800Watt Power of Bottom Infrared Pre-heater       3200Watt Speed of Side Cooling Fan                      3.5/min Camera                                                   12V/300mA                                                                22*10 times magnifying                                                                Horizontal resolution: 480 lines                                                                PAL format Outside K-type Sensor                            5 pcs Communication                                        RS-232C(connect with PC) Outer Dimensions                                    1150(L)*800(W)*800(H)mm Weight                                                    About 120kg Main Parts: Heating System Use large-power brushless DC fan; temperature controlled by closed loop sensor and zero triggering; large generation of hot air. Program can be set to control top and bottom hot air temperature; Control heating of bottom infrared pre-heater separately; Accurate temperature and even thermal energy; Various types of titanium nozzles available, easy to replace.

    
Heating power of top and bottom heater: 800 Watt both. Hot air volume which can be stepless
adjusted can result in rapid temperature rising of main heating area, even distribution and minimizes
temperature differences between chip surface and soldering joint to shorten operating time.

Bottom large-area infrared preheating mechanism is used. Except the central two heating plates, all
other heating plates are controlled by right switch. Users can decide which heating plates should be
in use according to materials, thickness and size of PCB.

PCB Position Moving

X, Y, Z all use linear precision orbit and precision silk pole to operate together. Meanwhile, MAS
assembling system is also used with firm structure, smoth, accurate and reliable adjustment. Whether
for fine adjustment or rough adjustment, it;s controlled by program set by precision motor to ensure
the accuracy of position moving.

Adopts rocker to control bottom movement in all directions. The movement speed changes in
accordance with the shaking speed. When aligning rocker can also be used to achieve alignment
of component. Turning the rocker can control 360 rotating of nozzles, thus completing aligning
process.

Can set, revise and observe the critical temperature of soldering process by hand controlling the
keyboard even without PC.

Aligning System
Aligning system and heating system are in the same working area, with the holding out or drawing
back of camera controlled by precision motor. The perfect integration of two parts ensures the
precision aligning and speed of aligning.
   
Use optical lens to align components. Red top light and white bottom light which brightness can be
adjusted. The lens reflects light to make the light of BGA solder ball and PCB solder pat in line
with each other.
Through camera of PL, solder ball and solder pat can be clearly viewed in the monitor. By rocker
adjusting, solder ball displayed in red solder pat in white will be completely overlapped.

Cooling System

Triple side cooling at the same time make BGA and PCB cooled down gradually. The air volume
of side cooling fan can be adjusted as per requirement.
The top and bottom cooling system work together. Air volume can be controlled by setting program
to make BGA temperature drops stable and reliable.
With the side cooling fan, air volume can be adjusted to meet different demands and prevent PCB
from being distorted.

In case of emergency, press "red" button to cut off the power to protect the equipment.

QUICKSOFT:

Operating Interface

Real-timely reflects actual conditions of process and real timely controls the desoldering process.

Aligning Interface

Can complete the whole aligning process of IC including image focusing, zooming in and out and
component picking-up.

Section Magnifying

When single click left corner area, the image in the area will be magnified so as to make aligning
and operation convenient.

Parameter Testing Interface

When desoldering new IC, can set parameters to try desoldering so as to get the most suitable
parameters for process.

Curve Analyzing Interface

Analyze the curve of process to learn about peak temperature, protortion of temperature rising,
temperature change of every heating process and the time needed, thus judging is it's suitable for
process.

Superior Setup

Can set operating permission, communication, video etc. Value temperature and colors as well as
width of temperature curve can also be set up.

Spare Parts:


The flexible PCB supporting rod can effectively fix PCB and absorb the expansion force resulted
from heating or cooling to aviod the distortion of PCB.
For special PCB, different clamps can be used to fix it. For large PCB, the bottom supporting rod
is available to avoid the distortion.

The nozzles used to pick up BGA while desoldering and nozzles needed while aligning can be
selected according to the sizes of BGA/CSP.

                                           Nozzles                                                     Nozzles adapter
Nozzles can be customized as per the customer's requirement.